ON 20080420@7:04:11 PM at page:
http://www.piclist.com/com/cadsoftusa/notes.htm#39557.1200810185
James Newton[JMN-EFP-786] published post 39557.1200810185

<A TITLE="P-70.145.147.85" NAME="39557.1200810185" HREF="mailto:brandnj@auburn.edu">brandnj@auburn.edu</A> <BLOCKQUOTE><A NAME="70.145.147.85">
</A> 
I agree with takethis....<BR>
<BR>
I had no real trouble with the pours once I routed the entire board.<BR>
<BR>
This was the first board I have done.....So I am not really sure what I am talking about.<BR>
<BR>
My pours are on the top layer...<BR>
<BR>
Are you making an entire layer a ground plane and then connecting your ground pads through vias/thermals...what is the difference b/t the two....</BLOCKQUOTE>

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