Received: from PCH.mit.edu (18.7.21.50) by mail.efplus.com (192.168.0.8) with Microsoft SMTP Server (TLS) id 8.3.485.1; Tue, 9 Feb 2021 15:28:21 -0800 Received: from PCH.MIT.EDU (localhost.localdomain [127.0.0.1]) by PCH.mit.edu (8.14.7/8.12.8) with ESMTP id 119NI1bl022160; Tue, 9 Feb 2021 18:18:43 -0500 Received: from outgoing-exchange-7.mit.edu (OUTGOING-EXCHANGE-7.MIT.EDU [18.9.28.58]) by PCH.mit.edu (8.14.7/8.12.8) with ESMTP id 119NHxCR022157 (version=TLSv1/SSLv3 cipher=DHE-RSA-AES256-GCM-SHA384 bits=256 verify=FAIL) for ; Tue, 9 Feb 2021 18:17:59 -0500 Received: from w92exedge4.exchange.mit.edu (W92EXEDGE4.EXCHANGE.MIT.EDU [18.7.73.16]) by outgoing-exchange-7.mit.edu (8.14.7/8.12.4) with ESMTP id 119NHXwj008226 for ; Tue, 9 Feb 2021 18:17:59 -0500 Received: from w92expo18.exchange.mit.edu (18.7.74.72) by w92exedge4.exchange.mit.edu (18.7.73.16) with Microsoft SMTP Server (TLS) id 15.0.1293.2; Tue, 9 Feb 2021 18:16:56 -0500 Received: from oc11exhyb4.exchange.mit.edu (18.9.1.100) by w92expo18.exchange.mit.edu (18.7.74.72) with Microsoft SMTP Server (TLS) id 15.0.1365.1; Tue, 9 Feb 2021 18:17:50 -0500 Received: from NAM02-BL2-obe.outbound.protection.outlook.com (104.47.38.55) by oc11exhyb4.exchange.mit.edu (18.9.1.100) with Microsoft SMTP Server (TLS) id 15.0.1395.4 via Frontend Transport; Tue, 9 Feb 2021 18:17:50 -0500 Received: from MW4PR04CA0229.namprd04.prod.outlook.com (2603:10b6:303:87::24) by BYAPR01MB3637.prod.exchangelabs.com (2603:10b6:a02:82::16) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384) id 15.20.3805.17; Tue, 9 Feb 2021 23:17:48 +0000 Received: from CO1NAM11FT036.eop-nam11.prod.protection.outlook.com (2603:10b6:303:87:cafe::3d) by MW4PR04CA0229.outlook.office365.com (2603:10b6:303:87::24) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384) id 15.20.3846.26 via Frontend Transport; Tue, 9 Feb 2021 23:17:47 +0000 Received: from mail-lf1-f47.google.com (209.85.167.47) by CO1NAM11FT036.mail.protection.outlook.com (10.13.174.124) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384) id 15.20.3846.25 via Frontend Transport; Tue, 9 Feb 2021 23:17:47 +0000 Received: by mail-lf1-f47.google.com with SMTP id m22so76991lfg.5 for ; Tue, 09 Feb 2021 15:17:47 -0800 (PST) From: RussellMc To: Microcontroller discussion list - Public. Sender: "piclist-bounces@mit.edu" Date: Tue, 9 Feb 2021 15:17:08 -0800 Subject: Re: [EE] lead free solder alloys? Thread-Topic: [EE] lead free solder alloys? Thread-Index: Adb/O0H40ULGsIQ9R1a65xUXro2tUQ== Message-ID: References: List-Help: List-Subscribe: , List-Unsubscribe: , In-Reply-To: Reply-To: Microcontroller discussion list - Public. Accept-Language: en-US X-MS-Exchange-Organization-AuthAs: Anonymous X-MS-Exchange-Organization-AuthSource: TS500.efplus4.local X-MS-Has-Attach: X-Auto-Response-Suppress: All X-MS-Exchange-Organization-SenderIdResult: Pass X-MS-Exchange-Organization-PRD: mit.edu X-MS-TNEF-Correlator: received-spf: Pass (protection.outlook.com: domain of gmail.com designates 209.85.167.47 as permitted sender) receiver=protection.outlook.com; client-ip=209.85.167.47; helo=mail-lf1-f47.google.com; dkim-signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=mime-version:references:in-reply-to:from:date:message-id:subject:to; bh=V/uuXAONdE94q6ILeJTU3J3DniUc6qyuoQfrykpt9ZI=; b=CrZrmjpG2P3UXHIPSpFd+R2HKLFBP5u6TjjMHn7i4j7G/GfFHzx/3qrJJbb+1V+XAe NFdWPLGWqxC3vGAt93bRJZeQJm3MZ5V6kI2vmSKOMAMOCLEkIdKS1KVevZwjEQ3sAtfl Ep30GOdf4vohDsjQJqUND0MyObWM+tclV/OAmfZ7/7ro9bmgxc8eH3d96Zj0djLwxBoy F0Qfbg+0//Udgtpf7oBIQTJjZ8YY8CMFGmcB5kY2mjEGa3xqU65x6oUjZLcvDpO4Zwkw itH38Y8xsFzsBcPHkffmGNPYd6+6IE0LaNzg9NestCp3fo4ETrsUAlKDzthWpPP43rqg B4YA== authentication-results: spf=pass (sender IP is 209.85.167.47) smtp.mailfrom=gmail.com; mit.edu; dkim=pass (signature was verified) header.d=gmail.com; mit.edu; dmarc=pass action=none header.from=gmail.com; errors-to: piclist-bounces@mit.edu list-id: "Microcontroller discussion list - Public." list-post: x-beenthere: piclist@mit.edu x-mailman-version: 2.1.6 x-received: by 2002:a05:6512:3590:: with SMTP id m16mr152011lfr.344.1612912665631; Tue, 09 Feb 2021 15:17:45 -0800 (PST) x-topics: [EE] x-content-filtered-by: Mailman/MimeDel 2.1.6 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable MIME-Version: 1.0 On Wed, 10 Feb 2021 at 07:00, Jason White wrote: > ... Turns it the alloy was 99.7 Sn (tin) and 0.3% Cu (copper). > > An aside: High tin solders are liable to exhibit the dread "tin whisker" effects - sometimes many years after use, sometimes sooner. Russell --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .