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Sender: "piclist-bounces@mit.edu" Date: Thu, 31 Dec 2020 13:55:33 -0800 Subject: Re: [EE] CMOS LED "Chip Interconnect" Thread-Topic: [EE] CMOS LED "Chip Interconnect" Thread-Index: AdbfwTpi+/K8/5fHRwWk8aRxUFqXMA== Message-ID: References: List-Help: List-Subscribe: , List-Unsubscribe: , In-Reply-To: Reply-To: Microcontroller discussion list - Public. Accept-Language: en-US X-MS-Exchange-Organization-AuthAs: Anonymous X-MS-Exchange-Organization-AuthSource: TS500.efplus4.local X-MS-Has-Attach: X-Auto-Response-Suppress: All X-MS-Exchange-Organization-SenderIdResult: Pass X-MS-Exchange-Organization-PRD: mit.edu X-MS-TNEF-Correlator: received-spf: Pass (protection.outlook.com: domain of gmail.com designates 209.85.208.42 as permitted sender) receiver=protection.outlook.com; client-ip=209.85.208.42; helo=mail-ed1-f42.google.com; dkim-signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=mime-version:in-reply-to:references:from:date:message-id:subject:to; bh=DicGV8I0UOyYw0IEG3hMDGLj2+GLjmauX94zLKRGP6I=; b=JYT5WPhd72ZQy6wNQmyaWGVq3Igg46WePHuWsM6z1prhsxb1MMBe4hDECzgAXkMmvb wCqEqth+l0BatdfxRNygY80Iz0/ojQYobnmiXhX0753cUrB5udSc9PWegIUPdrC5qjRr mEdykWDb2aqSmVcNaxOcU7d2tPLFn8Hto26lQKHuQ67FhBwrbKE52ru2NVMRpR1WDZRZ sHYvJqAOop6Zjx78SW2csRqRgXyGRuocL9unxNy50nkhdGfieeprSLU9vssjsnqWY+BI T0SaRz6OFMh8pgi2aeG5aIhYasvur04FSRCRjYm8wyuljNKQIE6q2NzHDrVGPxuX7lya l3uQ== authentication-results: spf=pass (sender IP is 209.85.208.42) smtp.mailfrom=gmail.com; mit.edu; dkim=pass (signature was verified) header.d=gmail.com; mit.edu; dmarc=pass action=none header.from=gmail.com; errors-to: piclist-bounces@mit.edu list-id: "Microcontroller discussion list - Public." list-post: x-beenthere: piclist@mit.edu x-mailman-version: 2.1.6 x-received: by 2002:aa7:c891:: with SMTP id p17mr29269716eds.309.1609451734089; Thu, 31 Dec 2020 13:55:34 -0800 (PST) x-topics: [EE] x-content-filtered-by: Mailman/MimeDel 2.1.6 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable MIME-Version: 1.0 Kinda, I meant communications between different areas on the same die using light - with all the memory, logic gates, clocking, etc also on the same silicon die as the LEDs and photodiodes. What you linked to seems to be a bit different in purpose and implementation - but maybe I have overlooked something? The article I linked to claims this to be the 'first demonstration' of said thing. But, I am no expert. On Thursday, December 31, 2020, Manu Abraham wrote= : > You meant something like co-packaged optics (on chip laser) ? > > https://newsroom.intel.com/news/intel-demonstrates- > industry-first-co-packaged-optics-ethernet-switch/ > https://www.lightwaveonline.com/optical-tech/components/ > article/14169514/intel-demos-tofino-2-ethernet-switch-with- > copackaged-optics > https://www.servethehome.com/hands-on-with-the-intel-co- > packaged-optics-and-silicon-photonics-switch/ > > Regards, > Manu > > > On Fri, Jan 1, 2021 at 2:11 AM Jason White > wrote: > > > > I saw this article [1] on Hackaday. LEDs on standard silicon dies using= a > > "cmos" process. Perhaps one day we will have optoelectronic processor > built > > using this process? > > > > [1] https://www.eenewseurope.com/news/first-cmos-led-chip-interconnect# > > > > > > -- > > Jason White > > -- > > http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive > > View/change your membership options at > > http://mailman.mit.edu/mailman/listinfo/piclist > -- > http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist > --=20 Jason White --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .