Received: from PCH.mit.edu (18.7.21.50) by mail.efplus.com (192.168.0.8) with Microsoft SMTP Server (TLS) id 8.3.485.1; Thu, 31 Dec 2020 13:26:38 -0800 Received: from PCH.MIT.EDU (localhost.localdomain [127.0.0.1]) by PCH.mit.edu (8.14.7/8.12.8) with ESMTP id 0BVLHTgd006785; Thu, 31 Dec 2020 16:18:13 -0500 Received: from outgoing-exchange-3.mit.edu (OUTGOING-EXCHANGE-3.MIT.EDU [18.9.28.13]) by PCH.mit.edu (8.14.7/8.12.8) with ESMTP id 0BVLHRVK006782 (version=TLSv1/SSLv3 cipher=DHE-RSA-AES256-GCM-SHA384 bits=256 verify=FAIL) for ; Thu, 31 Dec 2020 16:17:27 -0500 Received: from w92exedge3.exchange.mit.edu (W92EXEDGE3.EXCHANGE.MIT.EDU [18.7.73.15]) by outgoing-exchange-3.mit.edu (8.14.7/8.12.4) with ESMTP id 0BVLHO9L001612 for ; Thu, 31 Dec 2020 16:17:27 -0500 Received: from oc11expo20.exchange.mit.edu (18.9.4.51) by w92exedge3.exchange.mit.edu (18.7.73.15) with Microsoft SMTP Server (TLS) id 15.0.1293.2; Thu, 31 Dec 2020 16:16:45 -0500 Received: from oc11exhyb6.exchange.mit.edu (18.9.1.111) by oc11expo20.exchange.mit.edu (18.9.4.51) with Microsoft SMTP Server (TLS) id 15.0.1365.1; Thu, 31 Dec 2020 16:17:25 -0500 Received: from NAM04-SN1-obe.outbound.protection.outlook.com (104.47.44.53) by oc11exhyb6.exchange.mit.edu (18.9.1.111) with Microsoft SMTP Server (TLS) id 15.0.1395.4 via Frontend Transport; Thu, 31 Dec 2020 16:17:24 -0500 Received: from BN4PR13CA0007.namprd13.prod.outlook.com (2603:10b6:403:3::17) by SN6PR01MB4304.prod.exchangelabs.com (2603:10b6:805:a6::23) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384) id 15.20.3700.27; Thu, 31 Dec 2020 21:17:23 +0000 Received: from BN8NAM11FT012.eop-nam11.prod.protection.outlook.com (2603:10b6:403:3:cafe::4) by BN4PR13CA0007.outlook.office365.com (2603:10b6:403:3::17) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384) id 15.20.3742.4 via Frontend Transport; Thu, 31 Dec 2020 21:17:22 +0000 Received: from mail-yb1-f181.google.com (209.85.219.181) by BN8NAM11FT012.mail.protection.outlook.com (10.13.177.55) with Microsoft SMTP Server (version=TLS1_2, cipher=TLS_ECDHE_RSA_WITH_AES_256_GCM_SHA384) id 15.20.3700.29 via Frontend Transport; Thu, 31 Dec 2020 21:17:22 +0000 Received: by mail-yb1-f181.google.com with SMTP id b64so18281808ybg.7 for ; Thu, 31 Dec 2020 13:17:22 -0800 (PST) From: Manu Abraham To: Microcontroller discussion list - Public. Sender: "piclist-bounces@mit.edu" Date: Thu, 31 Dec 2020 13:17:07 -0800 Subject: Re: [EE] CMOS LED "Chip Interconnect" Thread-Topic: [EE] CMOS LED "Chip Interconnect" Thread-Index: Adbfu6A7oDG4aCKmRHuXkLfKn7s2ZQ== Message-ID: References: List-Help: List-Subscribe: , List-Unsubscribe: , In-Reply-To: Reply-To: Microcontroller discussion list - Public. Accept-Language: en-US X-MS-Exchange-Organization-AuthAs: Anonymous X-MS-Exchange-Organization-AuthSource: TS500.efplus4.local X-MS-Has-Attach: X-Auto-Response-Suppress: All X-MS-Exchange-Organization-SenderIdResult: Pass X-MS-Exchange-Organization-PRD: mit.edu X-MS-TNEF-Correlator: received-spf: Pass (protection.outlook.com: domain of gmail.com designates 209.85.219.181 as permitted sender) receiver=protection.outlook.com; client-ip=209.85.219.181; helo=mail-yb1-f181.google.com; dkim-signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=mime-version:references:in-reply-to:from:date:message-id:subject:to; bh=AOcKmptOyKPIc7eJykbcFrlGNWDHHxkJRKGNTGXYnCM=; b=mHcbX0zc4Tunn0qjRTmRkQkU5KG/lA/3iy+ASOYhWyT11zUTze2Dx5m2HYEyten5fd KRf9tIbLp+KMDxlRu85yGQ1NfFUi+K5HE98ZEx9UAfEl9l6VSPLN43+0D0I4a4X14JE4 SslgxhmA6ETL2xwhEpmEEvwirpFAnAs1k8I3dv/TisjRMN0wvscu/VO3uo/3t6SbjduH Z/xILCftTRjWHD/wvThqiqSjxkH2cmzb76aPHwDvFBII9WTLAxv2tW5cwykoXGrJlM5H MYHjs92Wmko0u6AxNTz4zlcq4GBZAXGIRaRa4XeuXW3/K9hcWHEUyQGTrcPBrZEwKr85 lgJw== authentication-results: spf=pass (sender IP is 209.85.219.181) smtp.mailfrom=gmail.com; mit.edu; dkim=pass (signature was verified) header.d=gmail.com; mit.edu; dmarc=pass action=none header.from=gmail.com; errors-to: piclist-bounces@mit.edu list-id: "Microcontroller discussion list - Public." list-post: x-beenthere: piclist@mit.edu x-mailman-version: 2.1.6 x-received: by 2002:a25:3415:: with SMTP id b21mr77589717yba.368.1609449442022; Thu, 31 Dec 2020 13:17:22 -0800 (PST) x-topics: [EE] Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable MIME-Version: 1.0 You meant something like co-packaged optics (on chip laser) ? https://newsroom.intel.com/news/intel-demonstrates-industry-first-co-packag= ed-optics-ethernet-switch/ https://www.lightwaveonline.com/optical-tech/components/article/14169514/in= tel-demos-tofino-2-ethernet-switch-with-copackaged-optics https://www.servethehome.com/hands-on-with-the-intel-co-packaged-optics-and= -silicon-photonics-switch/ Regards, Manu On Fri, Jan 1, 2021 at 2:11 AM Jason White wrote: > > I saw this article [1] on Hackaday. LEDs on standard silicon dies using a > "cmos" process. Perhaps one day we will have optoelectronic processor bui= lt > using this process? > > [1] https://www.eenewseurope.com/news/first-cmos-led-chip-interconnect# > > > -- > Jason White > -- > http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .