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([2804:7f3:80:93ab:6838:4197:f364:dcad]) by smtp.gmail.com with ESMTPSA id u4sm2867587qkk.68.2020.09.25.18.18.05 for (version=TLS1_2 cipher=ECDHE-ECDSA-AES128-GCM-SHA256 bits=128/128); Fri, 25 Sep 2020 18:18:06 -0700 (PDT) From: Isaac Marino Bavaresco To: Microcontroller discussion list - Public. Sender: "piclist-bounces@mit.edu" Date: Fri, 25 Sep 2020 18:18:04 -0700 Subject: Re: [EE] Hand soldering fine pitch packages Thread-Topic: [EE] Hand soldering fine pitch packages Thread-Index: AdaTpJhvtp87fkFvQ+y2+VUUuxvcCg== Message-ID: References: List-Help: List-Subscribe: , List-Unsubscribe: , In-Reply-To: Reply-To: Microcontroller discussion list - Public. Accept-Language: en-US X-MS-Exchange-Organization-AuthAs: Anonymous X-MS-Exchange-Organization-AuthSource: TS500.efplus4.local X-MS-Has-Attach: X-Auto-Response-Suppress: All X-MS-Exchange-Organization-SenderIdResult: Pass X-MS-Exchange-Organization-PRD: mit.edu X-MS-TNEF-Correlator: received-spf: Pass (protection.outlook.com: domain of gmail.com designates 209.85.222.179 as permitted sender) receiver=protection.outlook.com; client-ip=209.85.222.179; helo=mail-qk1-f179.google.com; dkim-signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20161025; h=date:user-agent:in-reply-to:references:mime-version :content-transfer-encoding:subject:to:from:message-id; bh=VYHgBgRo0ZrJFHtRTd5UBUMWbrN6iwQoqSzzMNTWOt4=; b=X7cL0KXXGgkl9T5En4oEW65QBY3G+3QBpxe3Qj+JVqtmHTZ56dSQPzCKUHZskXwkqJ o6v+usbgeNiZNUKuiaFXO+NDM14MxKEAme+uoXfvvNmAXfBmVZIbtgQ2W56F9WsZLSYp OAU01f4/AUUnAv0t+XASN/di/jLyqhj4983EgMXAc51Ha1v+KboDLyT8O2zKVpamFRlv LhQcavQhfPf3pWlMTFS+5IoWS82FKX8nVul/DxQYC1RFRkSIfz3o3C3ye/4vTMIVCrby Wxlpv01ppWffTSB4+WgDZye3B/849smZws7MrkvExkWk/ijl6BeMZzqCT1oCTZQFLl5H pL5w== authentication-results: spf=pass (sender IP is 209.85.222.179) smtp.mailfrom=gmail.com; mit.edu; dkim=pass (signature was verified) header.d=gmail.com; mit.edu; dmarc=pass action=none header.from=gmail.com; user-agent: K-9 Mail for Android errors-to: piclist-bounces@mit.edu list-id: "Microcontroller discussion list - Public." list-post: x-beenthere: piclist@mit.edu x-mailman-version: 2.1.6 x-received: by 2002:a37:909:: with SMTP id 9mr2851580qkj.317.1601083086808; Fri, 25 Sep 2020 18:18:06 -0700 (PDT) x-topics: [EE] x-content-filtered-by: Mailman/MimeDel 2.1.6 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable MIME-Version: 1.0 >>What are people doing for parts with a thermal pad? I.e. can one just put= a dab of solder paste on the pad or is it mandatory to use a stencil? With the soldering iron I apply a dab of solder to the board's and the IC"s= thermal pads. Then I use a hot air gun to heat the board from below, and w= ith tweezers I hold the IC in front of the nozzle until it is hot enough, t= hen I place it over its place on the board, adjusting its position and pres= sing it down a little. The excess solder just forms a ball at the border of= the body. When the IC is correctly positioned, I turn the gun off and wait a little, = until the solder solidifies, then I solder the regular pads around the IC. Cheers, Isaac --=20 Enviado de meu dispositivo Android com K-9 mail. Desculpe-me pela brevidade= .. --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .