From: Manu Abraham <abraham.manu@gmail.com>
To: Microcontroller discussion list - Public. <piclist@mit.edu>
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Date: Fri, 25 Sep 2020 00:54:02 -0700
Subject: Re: [EE] Hand soldering fine pitch packages
Thread-Topic: [EE] Hand soldering fine pitch packages
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Hi Bob,

On Fri, Sep 25, 2020 at 12:03 AM Bob Blick <bobblick@outlook.com> wrote:
>
> What I describe may already be a common practice, but it's something I've=
 just recently started doing.
>
> When hand soldering an IC, something like a 0.5mm pitch LQFP, I would usu=
ally tack a couple of pins down, maybe brush on a little liquid flux, solde=
r the rest of the pins as best I could, then clear all the shorts and even =
the soldering out with solder wick. Then clean the flux off and inspect.
>
> But lately what I do is skip the soldering part, just go straight to the =
solder wick. The wick needs to have some solder on it. In other words, appl=
y the solder with the product meant to remove solder.
>
> Anyway, I've found it to be faster and cleaner, and uses less solder and =
less solder wick.


There 's one more aspect you might not have realized. With that procedure,
even when you have components with oxidized pins, the solder process is eas=
ier.
The heat + the abrasive effect of the wick does the trick most of the times=
..
Tacking a few pins at some points do help improve how much abrasion you can
cause though.

Cheers,

Manu

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