From: Neil <picdude3@narwani.org>
To: Microcontroller discussion list - Public. <piclist@mit.edu>
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Date: Thu, 24 Sep 2020 15:35:52 -0700
Subject: Re: [EE] Hand soldering fine pitch packages
Thread-Topic: [EE] Hand soldering fine pitch packages
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I run the length of the wick across all the pins, then drag the=20
soldering tip across the wick, while lifting the wick perpendicularly=20
away from pins.
But NEVER sliding the wick on the pins, as that will catch the pins and=20
bent them very easily.




On 9/24/2020 6:24 PM, Bob Blick wrote:
> Give my method a try sometime. It uses far less solder and solder wick, b=
ut the real advantage for me is less cleanup. Flood filling adds a lot of b=
urned flux. With my method, you only need to use a little bit of flux, and =
the solder on the wick has no remaining flux. And while you are dragging th=
e wick, it's doing the soldering and pulling some of the fresh hot flux awa=
y.
>
> Anyway, I suggest giving it a try. So far I haven't decided which directi=
on to face the wick works best, facing in, out, or sideways from the part.
>
> Friendly regards, Bob
>
> ________________________________________
> From: piclist-bounces@mit.edu <piclist-bounces@mit.edu> on behalf of K S
> Sent: Thursday, September 24, 2020 2:49 PM
> To: Microcontroller discussion list - Public.
> Subject: Re: [EE] Hand soldering fine pitch packages
>
> I flood (like really flood) the entire row with solder, let it set, then
> place the PCB on its edge so the row is now vertical and slowly remelt th=
e
> solder from top to bottom. The surface tension collects the excess on the
> way down and usually, for a 0.4mm pitch, only the last 2 or 3 pins requir=
e
> a touch-up with wick. For all four rows of a 120 pin QFP this usually tak=
es
> a lot less time than the aligning part. Extra flux not usually required.
> Make sure you don't drop the molten blob of solder at the end on other
> parts of the board.
> --
>

--=20
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