From: Neil <picdude3@narwani.org>
To: Microcontroller discussion list - Public. <piclist@mit.edu>
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Date: Thu, 24 Sep 2020 11:56:35 -0700
Subject: Re: [EE] Hand soldering fine pitch packages
Thread-Topic: [EE] Hand soldering fine pitch packages
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That's mostly what I do for SSOP's and LQFP's... tack, align/tweak,=20
flood solder, wick, then de-flux.
I don't even add flux anywhere because I'm flood soldering.
Some years ago, I went through an eval of several different wicks (as=20
I've done for solders, solder pastes, tweezers, flush cutters, etc ;) )=20
and found one that worked great without adding flux... Techspray 1821=20
(for no-clean flux).  I don't know if it's the most expensive, but it's=20
the functionally best one I've found for my uses.

Cheers,
-Neil.




On 9/24/2020 2:30 PM, Bob Blick wrote:
> What I describe may already be a common practice, but it's something I've=
 just recently started doing.
>
> When hand soldering an IC, something like a 0.5mm pitch LQFP, I would usu=
ally tack a couple of pins down, maybe brush on a little liquid flux, solde=
r the rest of the pins as best I could, then clear all the shorts and even =
the soldering out with solder wick. Then clean the flux off and inspect.
>
> But lately what I do is skip the soldering part, just go straight to the =
solder wick. The wick needs to have some solder on it. In other words, appl=
y the solder with the product meant to remove solder.
>
> Anyway, I've found it to be faster and cleaner, and uses less solder and =
less solder wick.
>
> And, of course, buy the most expensive solder wick you can find.
>
> Cheers,
> Bob

--=20
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