From: David C Brown <dcb.home@gmail.com>
To: Microcontroller discussion list - Public. <piclist@mit.edu>
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Date: Sun, 13 Sep 2020 00:35:47 -0700
Subject: Re: [EE] Four Layer Routing Strategy
Thread-Topic: [EE] Four Layer Routing Strategy
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Don't believe every thing you read on the internet  - except on PIClist :-)
I have never  had problems with ground plane loops and would advise you to
use pours.
__________________________________________
David C Brown
43 Bings Road
Whaley Bridge
High Peak                           Phone: 01663 733236
Derbyshire                eMail: dcb.home@gmail.com
SK23 7ND          web: www.bings-knowle.co.uk/dcb
<http://www.jb.man.ac.uk/~dcb>



*Sent from my etch-a-sketch*


On Sun, 13 Sep 2020 at 02:57, Josh Koffman <joshybear@gmail.com> wrote:

> Thank you all for the advice!
>
> Ok, sounds like keeping the inner layers as ground and 3.3V separately
> will be the best. No problems there.
>
> One thing about planes though, I once read an article about being
> careful using planes, that essentially small ground loops could form
> in them. Since then I've always had my planes as a separate net (ie
> not ground), and I connected them to the ground traces strategically.
> Each area of pour had only one connection to ground.
>
> Should I be using the pours a bit more liberally and letting them join
> all the pins on that actual net? That's easily done (actually easier
> than the way I have been doing it). I'd add thermals in to try to help
> make it easier to solder.
>
> The board service I've been using lately doesn't allow for
> blind/buried vias without a hefty upcharge. I am definitely not at
> that level, that's for sure!
>
> Thank you!
>
> Josh
> --
> A common mistake that people make when trying to design something
> completely foolproof is to underestimate the ingenuity of complete
> fools.
>         -Douglas Adams
> --
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