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Sender: "piclist-bounces@mit.edu" Date: Wed, 17 Jun 2020 13:18:06 -0700 Subject: Re: [OT] soldering mild steel sheet, galvanic corrosion? Thread-Topic: [OT] soldering mild steel sheet, galvanic corrosion? Thread-Index: AdZEGxgI63zMuhR8TxmfFXzuBITqAgASZaGAABKGpswADCOVgAAA/DHv Message-ID: References: <009501d6441b$334bf4f0$99e3ded0$@amulvey.com> , List-Help: List-Subscribe: , List-Unsubscribe: , In-Reply-To: Reply-To: Microcontroller discussion list - Public. Accept-Language: en-US Content-Language: en-US X-MS-Exchange-Organization-AuthAs: Anonymous X-MS-Exchange-Organization-AuthSource: TS500.efplus4.local X-MS-Has-Attach: X-Auto-Response-Suppress: All X-MS-Exchange-Organization-SenderIdResult: Pass X-MS-Exchange-Organization-PRD: mit.edu X-MS-TNEF-Correlator: acceptlanguage: en-US received-spf: Pass (protection.outlook.com: domain of outlook.com designates 40.92.5.109 as permitted sender) receiver=protection.outlook.com; client-ip=40.92.5.109; helo=NAM02-SN1-obe.outbound.protection.outlook.com; dkim-signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=outlook.com; s=selector1; h=From:Date:Subject:Message-ID:Content-Type:MIME-Version:X-MS-Exchange-SenderADCheck; bh=Xr2fj7CskjdemSRawUIjarGVFP1EDJdWVR/1NSOfk50=; b=JwT9x5Ye9qSZwKfhwkq3xSuZ1y6dUNuanO+OH7gSiCYUq4/gISXidSg+OtTDehckqFOAG9DNv9CpkQ9qEV9aWRENs9WHstNxK3M8cUrfsdZMo4f9RAsQEUuocCwIuIsLs13TpkQzCZdRulg2aSKs5yxv5WDnnfo+IqAt+o9ElHlkUhGKXYFIdR1a27TqSJeXXjj2J7oadK1/OqRjpOlQq7lmFiKqdQg9aP3EEX6BjAxGzMqXd9GGdH8wnnN+Ys1wC8vV7iPWf1bz0DRF+CW7bCxYQDlgqogC1evVUKJCn97j13dmH+i17hvFsnb06pbubSojD3J/TGn7/t8D4aNHmg== authentication-results: spf=pass (sender IP is 40.92.5.109) smtp.mailfrom=outlook.com; mit.edu; dkim=pass (signature was verified) header.d=outlook.com; mit.edu; dmarc=pass action=none header.from=outlook.com; errors-to: piclist-bounces@mit.edu list-id: "Microcontroller discussion list - Public." list-post: x-beenthere: piclist@mit.edu x-mailman-version: 2.1.6 x-topics: [OT] x-mime-autoconverted: from quoted-printable to 8bit by PCH.mit.edu id 05HKIWZK010188 Content-Type: text/plain; charset="us-ascii" Content-Transfer-Encoding: quoted-printable MIME-Version: 1.0 Yes, I was familiar with that, just wanted to relate to how it feels to wor= k with two different choices. If you are making floor panels, 50/50 solder might be a better choice than = 60/40. My experience with the two solders has mostly been with joining seam= s in horn antennas and EMC immunity chambers. Friendly regards, Bob ________________________________________ From: piclist-bounces@mit.edu on behalf of Sean B= reheny Sent: Wednesday, June 17, 2020 12:41 PM To: Microcontroller discussion list - Public. Subject: Re: [OT] soldering mild steel sheet, galvanic corrosion? The behavior you mention is characteristic of all non-eutectic mixtures. They have two "melting points" - a solidus point and a liquidus point. The properties of the semi-molten mixture in-between those two points is quite strange and typically some minimum force is needed to cause flow (unlike a liquid), but there is no elastic region (unlike a solid). Sean On Wed, Jun 17, 2020 at 10:03 AM Bob Blick wrote: > Interestingly, though, solder used for plumbing, sheet metal and other > large mechanical things like stained glass is rarely 60/40 like electroni= c > solder. The difference between it and 50/50 when it comes to workability = is > dramatic. 60/40 solder is harder to use in those applications because the > whole workpiece melts at once, whereas with 50/50 you can work a section > and have it fluid or slightly plastic, right next to an area that is stil= l > solid. There is a certain hysteresis to it that makes it more desirable i= n > that application. > > Best regards, Bob > > ________________________________________ > From: piclist-bounces@mit.edu on behalf of Sean > Breheny > Sent: Tuesday, June 16, 2020 10:03 PM > To: Microcontroller discussion list - Public. > Subject: Re: [OT] soldering mild steel sheet, galvanic corrosion? > > Hi Jason, > > On Tue, Jun 16, 2020 at 5:25 PM Allen Mulvey wrote: > > > Most of his solder was 60% > > lead and 40% tin. I used to borrow it for electronic projects. > > > > Is that a typo? The eutectic point is at 60% tin, 40% lead (typical > electronics solder). > > Sean > > --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .