On Sun, 17 Nov 2019 at 20:47, Bob Blick <bobblick@outlook.com> wrote:

> Since the connectors will already be tin plated, I wonder how that will
> effect the gold plating process? I guess I'll have to experiment...
>
> So called "immersion gold" is traditionally on a nickel base and is not a
> true plating process. It is a "catalytic replacement" of near surface
> atoms, and the 'black pads' which have been a problem auld lang syne are
> due to crevices between nickel crystalline structures. Over the last deca=
de
> plus (but quite a lot more recently) people have been proposing proprieta=
ry
> processes which sit on top of the nickel and prevent the crevice corrosio=
n.
> Finding papers that discuss what the actual coatings are is "harder". One
> material which works is Palladium -  which is a non starter for most of u=
s.
> Patent documents may well reveal what materials are used.


If you were REALLY lucky (and Murphy tends to prevent such luckiness) tin
may be on the list of secret coatings that work. But, I doubt it.

I do not know if anything other than cost presents the use of 'proper"
electroplated gold.


   Russell
--=20
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