I like the moldable form suggestion. Great tip On Fri, 1 Feb 2019 at 03:17, Peter wrote: > I have used HMG in this way also in limited cases when wires need to be > soldered to PCB, some boards are now 15+ year and going strong. > > More to prevent wire breakage during handling, and use neutral cure > silicon for the tougher component hold jobs though. > > How HMG is applied matters as Bob says, but in saying that I rarely use > it for important jobs, as I have seen it fail too! > > Peter. > > On 1/02/2019 5:46 am, Denny Esterline wrote: > > I have several products that have wires soldered to a PCB, that > connection > > is buried under a blob of hot melt. > > For the most part this is driven by my fear of the wires being abused > > during handling and assembly rather > > than concern about forces when in use. Some of them are 10+ years old a= t > > this point and I haven't seen > > any noteworthy failures. > > > > -Denny > -- > http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist > --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .