I have used HMG in this way also in limited cases when wires need to be=20
soldered to PCB, some boards are now 15+ year and going strong.

More to prevent wire breakage during handling, and use neutral cure=20
silicon for the tougher component hold jobs though.

How HMG is applied matters as Bob says, but in saying that I rarely use=20
it for important jobs, as I have seen it fail too!

Peter.

On 1/02/2019 5:46 am, Denny Esterline wrote:
> I have several products that have wires soldered to a PCB, that connectio=
n
> is buried under a blob of hot melt.
> For the most part this is driven by my fear of the wires being abused
> during handling and assembly rather
> than concern about forces when in use. Some of them are 10+ years old at
> this point and I haven't seen
> any noteworthy failures.
>
> -Denny
--=20
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