Hello,
some of you here have a lot of experience. What is in your opinion the
optimal hole and pad size for TH components on a double-sided PCB, to
help flow of solder from one side to the other?

And how does it change if the rheofore is round or square?

Is there an optimal formula to calculate min/max hole and pad sizes,
so one can, basing on the constraints (e.g. need to pass some traces
inbetween pads) decide in the most effective possible way the size
of drill hole and pad?

Thank you.

Kind regards,
Mario

PS: please don't tell me that CADs calculate it automatically.. I want
to learn, too.

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