First, thanks to all for your responses. I guess to clarify what I am looking for is, what are the layout=20 design rules/constraints that I need to be aware of when considering an=20 FCB design? I would anticipate that a PGA package would be a bad thing,=20 but what are the practical limits or guidelines that I should follow? =20 What are the special considerations that are unique to FCB design and=20 layout? I am sure that this things have been outlined someplace, but I=20 have been unable to locate them. -Phil- ------------------------------------------------------- The day the world runs out of beer, is just too terrible to think about. ------------------------------------------------------- On 10/9/2015 3:30 AM, alan.b.pearce@stfc.ac.uk wrote: >> The secret is in the circuit design. There are rules such as aligning th= e >> components with their longest side parallel to the folding lines. >> I don't think the camera manufacturers assemble the parts after the boar= ds >> are folded. Perhaps a second reflow in the oven after the board is folde= d >> may help to release the stress. >> >> Some parts like QFPs will not be possible to assemble on a bent board. > Agreed. I came into the project late, and apparently an early assembly ha= d components bottoming out because they hadn't been aligned as you say. For= tunately we didn't have any QFPs, so that wasn't a problem. What was a prob= lem (and the reason I got involved) was that they had farmed the PCB layout= to an outside contractor who used pad sizes that were too small, and when = hand soldering the ceramic capacitors were getting cracked because they tou= ched the components with the soldering iron. This board assembly was too la= rge to reflow solder - it was around 15 inches in diameter. The components = were placed on the board after it had been formed into the tube - it was th= e only way to do it, the stress on the components would be too much otherwi= se. > > > --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .