> The secret is in the circuit design. There are rules such as aligning the
> components with their longest side parallel to the folding lines.
> I don't think the camera manufacturers assemble the parts after the board=
s
> are folded. Perhaps a second reflow in the oven after the board is folded
> may help to release the stress.
>=20
> Some parts like QFPs will not be possible to assemble on a bent board.

Agreed. I came into the project late, and apparently an early assembly had =
components bottoming out because they hadn't been aligned as you say. Fortu=
nately we didn't have any QFPs, so that wasn't a problem. What was a proble=
m (and the reason I got involved) was that they had farmed the PCB layout t=
o an outside contractor who used pad sizes that were too small, and when ha=
nd soldering the ceramic capacitors were getting cracked because they touch=
ed the components with the soldering iron. This board assembly was too larg=
e to reflow solder - it was around 15 inches in diameter. The components we=
re placed on the board after it had been formed into the tube - it was the =
only way to do it, the stress on the components would be too much otherwise=
..



--=20
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