Does the same apply to assemblies ultrrasonically welded into a box I wonder? If so, this post could have saved us a bit of future strife - Thank= s Richard P On 18 December 2014 at 16:06, RussellMc wrote: > The following comment was made in a related post by Jesse Lackey but is > easily overlooked. > It seemed a useful enough snippet to be worth highlighting. > > * Jesse says that MEMS sensors are reliably destroyed by ultrasonic > cleaning. * > > MAY not apply to some products using them but worth noting. > > Micromachined sensors are increasingly common in accelerometers, gyros, > pressure transducers and more. > This would also apply to post-repair cleaning on eg smartphone or tablet > boards or some comms modules . > > > > Russell > > From: Jesse Lackey > Date: 18 December 2014 at 11:36 > > ... however, if you get a high failure rate > > you'll have a mess on your hands. A MEMS unit is more prone to damage > with rework (replacing the bad ones with known functional ones). > > > > > > *Also beware that if your contract assembler does ultrasonic cleaning > itwill destroy the MEMS. All of them, without exception, will > bedestroyed. (Which is better than just damaged in a hard to detect way.= ) > Lost several panels of 10 doing first-article check until that > wasdiscovered.* > -- > http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist > --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .