The following comment was made in a related post by Jesse Lackey but is
easily overlooked.
It seemed a useful enough snippet to be worth highlighting.

*  Jesse says that MEMS sensors are reliably destroyed by ultrasonic
cleaning. *

MAY not apply to some products using them but worth noting.

Micromachined sensors are increasingly common in accelerometers, gyros,
pressure transducers and more.
This would also apply to post-repair cleaning on eg smartphone or tablet
boards or some comms modules .



            Russell

From: Jesse Lackey <jsl-ml@celestialaudio.com>
Date: 18 December 2014 at 11:36

....  however, if you get a high failure rate

you'll have a mess on your hands.  A MEMS unit is more prone to damage
with rework (replacing the bad ones with known functional ones).





*Also beware that if your contract assembler does ultrasonic cleaning
itwill destroy the MEMS.  All of them, without exception, will
bedestroyed.  (Which is better than just damaged in a hard to detect way.)
Lost several panels of 10 doing first-article check until that
wasdiscovered.*
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