> > This is where you start going to aluminium core PCB with umpteen vias
> > in the tab mounting pad and very thin laminate layers. Aluminium core
> > at edge of PCB solidly attached to big piece of aluminium radiator,
> > and chip mounted as near the edge of the PCB as practical. Been there,
> > done similar things, not quite that level of dissipation, but had to
> > take such things into account.
>=20
> To get it away from the chip, yes.  But after some time, the heat will st=
ill
> build up inside the enclosure, unless I find a path for the heat to move =
out of
> the (IP67-sealed) case.  There is a heatsink version of the enclosure ava=
ilable,
> but I hear it's quite complicated to setup, so if I have to re-engineer f=
or that,
> I'll just go with a design that doesn't produce that much heat in the fir=
st
> place.

Hah, you need to try dealing with hot things in cold zones on a space fligh=
t instrument. You don't get any sort of convection, only conduction through=
 paths you set up and then radiation from the outside of the box.


--=20
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--=20
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