On 7/29/2014 4:42 AM, alan.b.pearce@stfc.ac.uk wrote:
> This is where you start going to aluminium core PCB with umpteen vias=20
> in the tab mounting pad and very thin laminate layers. Aluminium core=20
> at edge of PCB solidly attached to big piece of aluminium radiator,=20
> and chip mounted as near the edge of the PCB as practical. Been there,=20
> done similar things, not quite that level of dissipation, but had to=20
> take such things into account.=20

To get it away from the chip, yes.  But after some time, the heat will=20
still build up inside the enclosure, unless I find a path for the heat=20
to move out of the (IP67-sealed) case.  There is a heatsink version of=20
the enclosure available, but I hear it's quite complicated to setup, so=20
if I have to re-engineer for that, I'll just go with a design that=20
doesn't produce that much heat in the first place.

Cheers,
-Neil.

--=20
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