On Mon, Jul 7, 2014, at 10:27 PM, Vasile Surducan wrote: > On Mon, Jul 7, 2014 at 11:30 PM, Bob Blick wrote: > > On Mon, Jul 7, 2014, at 01:28 PM, Bob Blick wrote: > > > > > 40 pin DFN package, 5x7mm. > > > > Sorry, I meant QFN. Either way, no fun. > > > > I can guess because the soldering problems? This type of package i= s > much easy to manually solder than it looks, because of the solder paste > cohesion with the pads and the package is creating a sort of > auto-positioning if the solder is correctly melted. >=20 > The true problem is the PCB which requires a lot of thermal vias to > evacuate the heat into the ground plane and heatsink. Getting the proper amount of solder paste is also a problem, so it requires a stencil. Otherwise you have too much paste between pads and then you try to push it around with a needle. And the QFN package hides all the shorts from you. So no easy prototyping is what I was trying to say. But that's why they offer evaluation boards. Best regards, Bob --=20 http://www.fastmail.fm - The professional email service --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .