On Tue, 12 Nov 2013, IVP wrote:

>> Is it even possible to solder to it? I wonder if they tried printing on
>> kapton.
>
> They mention attaching components with conductive adhesive. If the
> tracks are bonded well enough to the substrate it would probably be
> a bit re-useable with the double-sided tape
>
> 0.1" pitch IC pins might be at the limit for epoxy. Can't imagine trying
> to cleanly get it onto a SOIC or TSOP unless there's a way to remove
> excess, as you'd do with a solder wick. Epoxy isn't selective about
> where it flows, unlike solder. Could get messy

Maybe some type of "rivet" could be developed to grab the lead of a=20
component and attach itself to both sides of the subtrate - kind of like a=
=20
blind rivet.

surface mount might just require a staple to hold the component in place.=20
Maybe a low melting point solder such as Field's metal to ensure good=20
contact.

Regards
Sergio
--=20
http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive
View/change your membership options at
http://mailman.mit.edu/mailman/listinfo/piclist
.