On Sun, Oct 13, 2013 at 7:47 PM, wrote: > Hi all, can't find any real info on this online so thought I'd ask you > guys. > The other day I tried my first "toaster oven" reflow, but instead of usin= g > solder paste I had first hit the pads with a soldering iron and standard > 63/37 solder wire, then plonked the components on top, as per a previous > "HASL reflow" thread. > Did you add any flux? Each melting of the solder needs more flux... Does you oven have a window? It's easy enough to time the reflow if you put little pieces of wire solder around the board. When the board passes through reflow temperature they go from wire-shaped to ball-shaped. --=20 Regards, Mark markrages@gmail --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .