At 13.26 2013.05.22, Isaac Marino Bavaresco wrote:
>Em 22/05/2013 04:13, Electron escreveu:
>
>> Thanks for the hints, at the end what I have to do is reduce mechanical
>> stress while using it (epoxy resin should do? I have to use it anyway), =
and
>> thermal stress while soldering. I've soldered them without care, I proba=
bly
>> did harm in that phase, although they were tested before resin was appli=
ed
>> so it remains my doubt: will epoxy resin cause even more physical stress=
?
>> should I protect the caps into a "blob" of silicone before applying the
>> hard resin? Could anybody answer this particular dilemma?
>>
>> Cheers,
>> Mario
>
>
>Using silicone to protect the components from direct contact with the
>epoxy seems a good idea.
>There are neutral cure silicones, they don't use acetic acid.

Thank You Isaac. I read between the lines that acetic acid silicone use is =
a no-no?

With kind regards,
Mario


>Best regards,
>
>Isaac
>
>
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