Hi,

I'm asking here for views rather than true legal advice=85.although I know =
there are a couple of PIClisters who are quite FCC-savvy, so they might be =
able to offer a definitive answer.

I understand that when certifying a device under Part 15 as an intentional =
radiator (our is in the 2.45GHz spectrum -- Bluetooth Low Energy, but we're=
 using a baseband chip and RF stage rather than a module) changing or addin=
g components is an absolute no-no except if they're 'direct equivalents'. N=
o problem there.

But what about if we were to get a device certified that had, say, sensor A=
, sensor B, and sensor C loaded on the board and then *remove* one or two o=
f those sensors for a specific application or market? If the whole device/a=
ssembly is certified, can we do that?

I will ask the testing house too, but wanted to see what y'all thought as w=
ell -- I'm sure the testing house will say "you should get each variant tes=
ted" :)

Thanks!

-m
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