On Tue, Apr 16, 2013 at 10:31 PM, Marc Nicholas wrot= e: > What package is the component in question? I have success without a stenc= il on just about any part that has exposed pads/pins=85a fine line of solde= r paste across the pins is one trick, followed by a quick visit to the toas= ter over. Interesting. I'm currently designing a project for myself that will use an LFSCP package (reference here: http://www.analog.com/en/technical-library/packages/csp-chip-scale-package/= lfcsp/index.html ), which will be the first time I'm using such a fine pitch, lead free device. I'm currently planning on making the pads a bit longer than usual, so I can try to touch an iron to them if things don't go well during reflow. I currently use laser cut mylar stencils, but the separation between the pads on fine pitch devices usually ends up a bit wonky, so I'm not sure what to do. I'm definitely afraid of too much paste causing a bridge. Josh -- A common mistake that people make when trying to design something completely foolproof is to underestimate the ingenuity of complete fools. -Douglas Adams --=20 http://www.piclist.com/techref/piclist PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .