On 21/07/2012 16:39, John Gardner wrote:
>   I do TSSOP boards with the glass range - Stencil/squeegee work
> is fiddly, but results are good.  Pads seem to brew up together, +/-
> a second or two.

I have never used a stencil.  For the really fine pitch parts I run a=20
small line of paste along the row of pads with a syringe.

> When you have the luxury of SOIC, it's a delight to place parts &
> flow boards -  The incorrigible amateur in me, no doubt.  :)
>
> For onesey-twosies, hard to beat.

I definitely should have clarified in my original post, I only do this=20
for amateur hobby boards.  It's a great cheap way of doing SMD and I=20
find it quicker than through-hole.

Clearly not a suitable method of running a real test/production line!

David
--=20
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