>=20
> I can't see a reason for doing the back-off. The situation you describe a=
bove
> will create chemical traps for the etchant, which are a definite no-no, a=
s
> that will likely create problems with corrosion further down the line, as=
 well
> as any over-etch problems that may exist.

Yes, which is why it (Designspark) doesn't do the backoff for a pad/track i=
f=20
the backoff rule is violated for that track/pad. In this case it will have =
the=20
same efect as plotting with 'Fill Pads' switched on. When I do my home etch=
ed=20
boards I always have the 'Fill Pads' switched on anyway. Come to think of i=
t, I=20
also have pads filled when I plot the gerber files for the board manufactur=
er.=20

The DRC for drill backoff can be switched off.

/Ruben

=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D
Ruben J=F6nsson
AB Liros Electronic
Box 9124
200 39 Malm=F6 Sweden
www.liros.se
Tel +46 40142078
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D

--=20
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