-----Original Message----- From: piclist-bounces@mit.edu [mailto:piclist-bounces@mit.edu] On Behalf Of= David Duffy (AVD) Sent: 19 June 2012 13:39 To: Microcontroller discussion list - Public. Subject: Re: [PIC] Samsung -> PIC Retrofit? >Yeah, I had thought of something like that. I'm not overly fussed on a pl= ug-in board >(with new chip) as we'd then have to secure it down. If there's no pin co= mpatible >PICs, we may just have to offer that solution to our client as an option I= guess. >David... PICs are now available in very small packages, e.g. DFN, uQFN and CSP so yo= u can probably make a plug in module which is no larger than the 20 Pin DIP= package. Mike =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D This e-mail is intended for the person it is addressed to only. The information contained in it may be confidential and/or protected by law. If you are not the intended recipient of this message, you must not make any use of this information, or copy or show it to any person. Please contact us immediately to tell us that you have received this e-mail, and return the original to us. Any use, forwarding, printing or copying of this message is strictly prohibited. No part of this message can be considered a request for goods or services. =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .