At 04:48 AM 2/14/2012, you wrote:
> > What I'm currently using is a piece of=20
> acrylic with a couple of dozen pockets milled
> > in it (all the way through).  I cover the=20
> back side with tape (for a seal), place my
> > modules in the proper spots, then pour epoxy=20
> and bake in an oven.  The problem
> > occurs when we go to remove the cured epoxy=20
> blobs from the form - its time consuming
> > even though we swabbed the sides of the mold with mold-release compound=
..
>
>You do have a slight angle on the sides of the=20
>mold? I would have thought this would be enough=20
>to allow release with a small tap from a wooden=20
>hammer or similar on the back side, seeing you=20
>already have access to the back by taking the=20
>tape off. If it won't come out, just how smooth=20
>has the cutter left the sides of the pockets? It=20
>may just be a case of polishing them with a release angle.

Exactly- the draft angle has to be much larger in a mold that is not
well polished. A WAG might be 3-4=B0 for a reasonably well polished rigid
mold material.

Best regards,

Spehro Pefhany --"it's the network..."            "The Journey is the rewar=
d"
speff@interlog.com             Info for manufacturers: http://www.trexon.co=
m
Embedded software/hardware/analog  Info for designers:  http://www.speff.co=
m




--=20
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