> What I'm currently using is a piece of acrylic with a couple of dozen poc= kets milled > in it (all the way through). I cover the back side with tape (for a seal= ), place my > modules in the proper spots, then pour epoxy and bake in an oven. The pr= oblem > occurs when we go to remove the cured epoxy blobs from the form - its tim= e consuming > even though we swabbed the sides of the mold with mold-release compound. You do have a slight angle on the sides of the mold? I would have thought t= his would be enough to allow release with a small tap from a wooden hammer = or similar on the back side, seeing you already have access to the back by = taking the tape off. If it won't come out, just how smooth has the cutter l= eft the sides of the pockets? It may just be a case of polishing them with = a release angle. --=20 Scanned by iCritical. --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .