This RoHS thing seems to exist only to cause huge reliability problems. :-/ By the way what is the punishment if a small company (I don't mean Swatch := D ) gets caught using non-RoHS compliant solder? Ball-cutting? Death penalty? O= r? =3D8-I At 23.11 2011.10.17, you wrote: >It's a common fault on some of the laptops, the GFX chip has no additional >cooling and lead-free solder balls have a habit of developing fractures wh= en >stressed. > >(old XBOX 360's (Red ring of death) and PS3's (Yellow light of death) have >similar problems) > > >-----Original Message----- >From: piclist-bounces@MIT.EDU [mailto:piclist-bounces@MIT.EDU] On Behalf O= f >V G >Sent: 17 October 2011 20:58 >To: Microcontroller discussion list - Public. >Subject: Re: [EE] Soldering BGA > >On Mon, Oct 17, 2011 at 3:42 PM, Jim Franklin >wrote: > >> It was only an AMD graphics chip on a laptop.. but I was determined to >win. >> (and I did). >> >> I only did it manually due to the busted template, I have a shiny new >> microscope, and a free afternoon. And it's good practice. >> > >Wow nice. What was wrong with the chip? Why was the reason for removing it >and reballing it? > >Also, my biggest problem with these thing BGA chips is designing the PCB a= nd >routing it. I can't go more than 2 layers or with fancy things like vias i= n >pads or ill get expensive. I have to stick with surface mount leaded >components only :( >--=20 >http://www.piclist.com PIC/SX FAQ & list archive >View/change your membership options at >http://mailman.mit.edu/mailman/listinfo/piclist > >--=20 >http://www.piclist.com PIC/SX FAQ & list archive >View/change your membership options at >http://mailman.mit.edu/mailman/listinfo/piclist --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .