On Mon, Oct 17, 2011 at 3:57 PM, V G wrote: > Also, my biggest problem with these thing BGA chips is designing the PCB = and > routing it. I can't go more than 2 layers or with fancy things like vias = in > pads or ill get expensive. I have to stick with surface mount leaded > components only :( You need 4 layers minimum and filled micro vias if you're going to do fine pitch BGA correctly. Yes, there may be other methods. 6 or many more layers for larger devices. --=20 Martin K. --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .