Re
> For space applications we need to use laminate that has thermal expansion=
 characteristics that match the components. The biggest hassle is leadless =
chip carriers (microchips QFN packages for example). For this purpose we us=
e polyimide laminate commonly, or other more expensive options that even be=
tter match the thermal expansion characteristics.

________

Dupont Kapton =3D Polyimide.

           http://www2.dupont.com/Kapton/en_US/

'Nice" 25 page mechanical properties document

   http://www2.dupont.com/Kapton/en_US/assets/downloads/pdf/summaryofprop.p=
df

Data sheet - 6 pages

      http://www2.dupont.com/Kapton/en_US/assets/downloads/pdf/Gen_Specs.pd=
f

Trademark usage.
Technical content free, but gives a good feel of how you may and may
not use or imitate a trademark

          http://www2.dupont.com/Kapton/en_US/assets/downloads/pdf/Kapton_T=
rademarkGuidelines.pdf



          Russell McMahon

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