V G wrote: > So it seems that I have to use this > BGApart > (can't find it in any other package). How would I go about soldering > it? Just place it on the PCB and stick it in the oven? My biggest concern= is > the positioning of the part on the pads. How would I know that it's align= ed > properly? How perfect does the aligning have to be? > =20 Afaict the aligning doesn't have to be perfect, the surface tension of=20 the balls will snap it into place if it's slightly off. The problem=20 comes if it's sufficiantly far off that it snaps to a 1 ball offset=20 rather than snapping to the correct position or if it decides to solder=20 itself to the vias instead of the pads (see below). If there is going to be a grid of vias under the BGA connected to the=20 grid of pads via 45 degree tracks it is strongly advisable to set up=20 your PCB package to cover the vias in soldermask. Another option is to=20 put the vias in the pads themselves but if you do this then those vias=20 need to be filled with solid copper which will increase your PCB=20 fabrication cost (given how fine this BGA is though you may have little=20 choice but to go for vias in pads). --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .