On Fri, September 30, 2011 3:29 am, alan.b.pearce@stfc.ac.uk wrote:
>
>
>> Bare die assembly is sometimes called "blob top."
>
> Is that a new euphemism for what is commonly called 'Chip On Board' ??

I wouldn't call it "new" but AFAIK they are the same thing.  I think 'Chip
on Board' is just the very precise way of saying 'blob top'

On Thu, September 29, 2011 10:04 pm, RussellMc wrote:
>> You can buy just the die, but (with Microchip) order qty on die is in # =
of
>> wafers- you buy all the parts that come off the wafer, and the minimum
>> order is a non-trivial number of wafers (it ends up being a LOT of parts=
).
>
>Makes protyping hard :-). Volume probably not an issue long term.

Considering the NRE, prototyping with die is unusual.

There is also 'chip scale' packaging, which is basically just the die,
flipped over, connected to the board with solder bumps- think BGA with no
package- just the silicon. Not a standard package though- the NRE is even
higher than blob top, I believe. I've only seen this on larger (16 bit)
parts.

For the super-tiny packages, it definitely isn't something you can get via
a catalog- you have to work directly with the manufacturer.


Matt Bennett
Just outside of Austin, TX
30.51,-97.91

The views I express are my own, not that of my employer, a large
multinational corporation that you are familiar with.
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