> -----Original Message----- > From: piclist-bounces@mit.edu On Behalf Of William "Chops" Westfield > Sent: Saturday, July 23, 2011 3:20 AM > > On Jul 15, 2011, at 1:20 AM, alan.b.pearce@stfc.ac.uk wrote: > > > your SOIC is an MS-012AA for an SO-8, through to MS-012AC for an > > SO-16 ... > > > > Once you get used to the JEDEC names they do work a lot better > > Is there any logic to the JEDEC names? Those examples seem pretty > random! There is at least some logic to the JEDEC package naming however, with the impossibility of predicting future packaging variations, I'm not certain they have been able to keep the logic fully intact over the last 50+ years. Here's the basics, The first two letters followed by a dash and a number give the basic package outline. Examples: MS-001 =3D Dual inline plastic family, 0.300 inch row spacing MS-012 =3D Plastic small outline family, 1.27mm pitch, 3.90mm body width MS-013 =3D Plastic small outline family, 1.27mm pitch, 7.50mm body width MO-187 =3D Plastic, low/thin/very thin, small outline package, 0.65 and 0.5= 0 pitch TO-92 =3D I hope everyone on the list knows what this one is :-) The letters following the base number give the variations in the package. Examples: MS-012AA =3D 8 pin, 4.90mm length MS-012AB =3D 14 pin, 8.65mm length MS-012AC =3D 16 pin, 9.90mm length The variation letters are logically assigned within each basic package type however an "A" in one package might not be the same variation as an "A" for another basic package. Paul Hutch > > BillW --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .