On Sat, 21 May 2011 20:42 -0700, "PICdude" wrote:

> I usually get shorted pins with SSOP PIC's also, but wick them off.  =20
> Using a 6-mil thick stencil, and on my next stencil, I'm going to try =20
> 5-mils, and perhaps smaller apertures to get less solder.

If your pad is rectangular, say 10 x 40 mils and you had the same for
your spencil and get too much solder, keep the copper pad dimension the
same but shorten the stencil's to say 10 x 20 mils, centered where the
chip's pins will be. As long as some solder gets between the pin and
pad, it will wick what it needs.

Making the stencil thinner doesn't give you as much versatility as
changing the holes in it.

Whatever you do, don't narrow the stencil holes unless you have to. The
application of the paste gets more irregular the smaller and less square
the holes are.

Cheerful regards,

Bob

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