How are you reflowing the top and bottom? I assume in two individual =20 passes? What happens if you swap the order you reflow them? I usually get shorted pins with SSOP PIC's also, but wick them off. =20 Using a 6-mil thick stencil, and on my next stencil, I'm going to try =20 5-mils, and perhaps smaller apertures to get less solder. Cheers, -Neil. Quoting Josh Koffman : > On Sat, May 21, 2011 at 12:40 PM, PICdude wrote: >> FWIW, in my early days of solder pasting (couple years ago), I tried >> using Chip-Quik repair paste in a small syringe that I got from >> Digikey and ground shipped. =A0Worked very well. =A0It's low cost (as it >> comes in a small tube), so perhaps try that as a test. =A0Ship faster to >> minimize issues. > > That's what this is. I think my main problem isn't with the paste, but > with my stencil. Interestingly enough, I generally don't get the > solder ball halo on the top of the board, only on the bottom. > > I'm also getting a lot of shorted pins on the TSSOP PIC, so I probably > need to reduce the amount of paste there. > > Josh > -- > A common mistake that people make when trying to design something > completely foolproof is to underestimate the ingenuity of complete > fools. > =A0 =A0 =A0 =A0 -Douglas Adams > > -- > http://www.piclist.com PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist > --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .