>  For space work, we always wicked off the gold, per a NASA spec, using
> solder before soldering a pin.  I think the small surface area of a SMT p=
ad
> also means that you'll have a higher gold/solder ratio than a through hol=
e
> joint and this may make matters worse.

Yes, we do too, in a two stage solder pot. The first solder pot is the 'de-=
golding', the second does the tinning.=20

The de-golding one needs period emptying as the gold concentration gets too=
 high for proper de-golding to take place. I am not normally involved in th=
is area, so don't know what the operating time of the pot is before the sol=
der needs changing.



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