> I was thinking that TSSOP would be a bit quicker to assembly
> (I do these by hand) as it's one part versus three. Is it just the
> size that makes it fiddly?

I've used TSSOP / MSOP (0.65mm pitch) a few times, mostly
because the device was available only in that package

You won't be able to solder them directly by hand, as you would
say for a DIP. My method is to tin the track before positioning the
chip and reflow that solder up the pin. The factory tinning on the
pin is enough to make a bond. If you want to add more solder,
don't get so close with the tip that the new solder blob can bridge
two pins. Just let it add to what's already there. It's doable with
a steady relaxed hand. Good sniper training !

Joe
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