I don't remember which mailing list someone recommended dipmicro electronics as a good source for copper clad but I ordered some supplies from them on Jul 27 and received my order today, Jul 29. Thats FAST ! They shipped via USPS from their warehouse in NY to my office in Louisiana.=20 I guess most of the credit was due to USPS but at least they shipped the same day.=20 http://www.dipmicro.com Best Regards, Steve Maroney Business Computer Support, LLC Mobile Phone:504-914-4704 Office Phone: 504-904-0266 Fax: 866-871-7797 -----Original Message----- From: piclist-bounces@mit.edu [mailto:piclist-bounces@mit.edu] On Behalf Of alan.b.pearce@stfc.ac.uk Sent: Thursday, July 29, 2010 8:35 AM To: piclist@mit.edu Subject: RE: [EE] Generic SMD pad layout catalogue? > And as I understand it (from discussions at the last SMTA event I went > to) that the pad sizes will vary based on the height of the part (to > vary the quantity of solder-paste applied), so two different > 0805-footprint parts may require different pad dimensions. So far, > I've had great success following the manufacturer's recommended > layouts in the datasheets. I've so far not had to change the pad > dimensions for hand soldering, but I've made pads larger if they're > supporting a component that is expected to get hot. >=20 > Cheers, > -Neil. Yes, that is because a 'good' joint has the solder fillet come half way up the component metallization. So a thin component requires a lower fillet, but the only way to get sufficient fillet on a taller component is to have a larger pad. --=20 Scanned by iCritical. --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist --=20 http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist .