> And as I understand it (from discussions at the last SMTA event I went
> to) that the pad sizes will vary based on the height of the part (to
> vary the quantity of solder-paste applied), so two different
> 0805-footprint parts may require different pad dimensions.  So far,
> I've had great success following the manufacturer's recommended
> layouts in the datasheets.  I've so far not had to change the pad
> dimensions for hand soldering, but I've made pads larger if they're
> supporting a component that is expected to get hot.
>=20
> Cheers,
> -Neil.

Yes, that is because a 'good' joint has the solder fillet come half way
up the component metallization. So a thin component requires a lower
fillet, but the only way to get sufficient fillet on a taller component
is to have a larger pad.
--=20
Scanned by iCritical.

--=20
http://www.piclist.com PIC/SX FAQ & list archive
View/change your membership options at
http://mailman.mit.edu/mailman/listinfo/piclist
.