Justin Richards wrote:
>> That sounds like quite a hassle.  I'd use the hot air soldering station,
>> with the right adapter for that size TQFP.  If you don't have a hot air
>> station, get someone that does to do it for you.  Without that, you take a
>> serious risk of damaging the pads.
>>
>> I will take this advice.
>>     
>
> I like to think I am quite resourceful but I cant see that any sort of sharp
> knife/scalpel would do the job without damage. It is just to tight.
>   
you just gently score along top of leads at the body where they are 
raised above the PCB.
Pop off the chip
you can then use pointy tweezers to remove 2 or 3 leads at a time, 
reflowing with ordinary 2mm to 3mm tip 21W or more iron.
No scraping or tugging or board damage.

A correct size nozzle and Hot Air station will allow you to lift of  
chip and even resolder with fine tweezers and without disturbing other 
parts much . The knife method is fatal to the chip.

A hot lamp plus masks and under PCB pre-heat BGA rework station is maybe 
better still.

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