When I was looking at producing boards with blind and buried vias (as well as embedded passives) I could not get any sort of pricing matrix or guidelines from any of the companies I queried. Ultimately I made several different designs that had features I was interested in, quoted them, and from that developed my own spreadsheet giving the approximate pricing differences. Even if I could remember what the results were, it was nearly 5 years ago and I'm certain the landscape has changed. In my case, the results were easily forgotten because the additional cost did not yield a significant enough benefit to go that route - but it did give me the incentive to pack several BGA packages onto a 6 layer 0.75 sq inch PCB. Of course, the design was killed before it went to market, but it was an interesting puzzle anyway. It was the same design where I had to find out the breakdown voltage of solder mask, and the thickness of solder mask provided by our fabs. At any rate, your best bet may simply be to get several quotes and use those to develop a ballpark cost matrix. -Adam On Tue, Mar 16, 2010 at 4:06 PM, Vitaliy wrote: > Hi List, > > I'm trying to get a better understanding of multilayer PCB design. > Unfortunately, the books we have in our library don't have the information > I'm after. Google hasn't been very helpful either, and the feedback we get > from PCB manufacturers is confusing (AC even told us they outsource their ML > PCBs, which was a shock to me -- they demonstrated the process when I > visited their plant back in 2007). > > Most of the questions I have concern manufacturability of multilayer PCBs. > It seems like almost any board house can make multilayer boards with > thru-board vias. But they get surprisingly evasive when we ask them about > what effect blind and buried vias will have on the cost of the PCB ("send us > your design and we'll quote it"). > > Can someone point me to a resource, be it a book, a webpage, or whatever, > that explains the manufacturing process for ML boards and specifically goes > into design for manufacturability and the tradeoffs? > > Seat-of-the-pants type feedback is also welcome. > > Best regards, > > Vitaliy > > -- > http://www.piclist.com PIC/SX FAQ & list archive > View/change your membership options at > http://mailman.mit.edu/mailman/listinfo/piclist > -- http://chiphacker.com/ - EE Q&A site -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist