Hi List,

I'm trying to get a better understanding of multilayer PCB design. 
Unfortunately, the books we have in our library don't have the information 
I'm after. Google hasn't been very helpful either, and the feedback we get 
from PCB manufacturers is confusing (AC even told us they outsource their ML 
PCBs, which was a shock to me -- they demonstrated the process when I 
visited their plant back in 2007).

Most of the questions I have concern manufacturability of multilayer PCBs. 
It seems like almost any board house can make multilayer boards with 
thru-board vias. But they get surprisingly evasive when we ask them about 
what effect blind and buried vias will have on the cost of the PCB ("send us 
your design and we'll quote it").

Can someone point me to a resource, be it a book, a webpage, or whatever, 
that explains the manufacturing process for ML boards and specifically goes 
into design for manufacturability and the tradeoffs?

Seat-of-the-pants type feedback is also welcome.

Best regards,

Vitaliy 

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