:: he NASA document referenced seems to be more worried about stress
:: induced on the component leads by differential expansion of the
:: component itself and the PCB material.  It looks like they want
:: some
:: length of bendable lead in the path between component and solder
:: connection.  For instance, there is no mention of clinching being
:: needed for axially mounted parts, and Section 8.4.5 states
:: explicitly

I again point people in the direction of IP610 Class 3 and Mil Spec 
documents - nice curly wires on PTH parts were/are required on Mil 
boards. Not sure what is required for SMD parts.

Colin
cdb, colin@btech-online.co.uk on 3/7/2010
 
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