Em 4/3/2010 18:53, Marechiare escreveu:
>> I don't understand your fixation to parallelism
>> between surfaces to be soldered!
>>     =

> Anyone EE on the list?  Any considerations?
>
> ---
> PS
> Olin is out of the list, so the question is likely to remain unanswered.
>   =


It is as almost everything in product design, a compromise between
cost/benefit.

Bending pins is time-consuming and difficults rework. Why would I do it
if I only use 1/8W resistors, ceramic capacitors, some DIP ICs,
sometimes some SOIC or TQFP, on a board that will be bolted to a wall?

As I told, we *never* had any solder joint failure for such type of
board, so why would I change my procedure?

If I were designing a single-sided board for a motorcycle CDI, as my
friend does, then I certainly would bend the pins.


Regards,

Isaac
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