I remember there are two things are not allowed for circuit boards on military applications:
1. the First one is non-lead solder, all military products requires using lead based solder.
2. the 2nd one forbidden is: ultrasonis cleaning on circuit boards.

I hears lots of story how lead makes a strong bond on solder joints, which is why military insist on using lead-based solder than alternatives.

However I don't quite understand why ultrasonic is forbidden. I knew certain chip using ultrosonic bond technology to tie wires to the die. But the energy density used in ultrasonic cleanning  isn't that strong. (I do see many commercial used circuit board are cleaned by ultrasonic cleaning machines.) I am curious Why it is not allowed for military application.

The following ultrasonic cleaning machine seems interesting (at least for civilian use):
http://ww2.harborfreight.com/cpi/ctaf/Displayitem.taf?itemnumber=95563
http://ww2.harborfreight.com/cpi/ctaf/Displayitem.taf?itemnumber=3305

 Funny N.
Au Group Electronics, http://www.AuElectronics.com
http://www.AuElectronics.com/products
http://augroups.blogspot.com/



      
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