On Wed, Jul 22, 2009 at 8:40 PM, solarwind wrote: > And I suppose certain parts can be MADE to be surface mount? For > example, bend the pins on a DIP package, bend the pins on though hole > resistors, capacitors and so on? You can do that, however, usually through hole components are bigger and heavier therefore such a mount may be mechanically insufficient. Once I cut a window to a dip IC in a way that I could bend the pins all the way sideways, so the IC was sitting in the window and the pins were surface mounted on the edge of the window. Can't remember what was that but I needed to make the circuit very flat. The work needed for this was much higher than placing a through hole or a normal surface mounting. Tamas -- http://www.piclist.com PIC/SX FAQ & list archive View/change your membership options at http://mailman.mit.edu/mailman/listinfo/piclist